Thursday, 27 September 2012

TIME FOR THE ETCHING & SOLDERING PROCESS

METHODOLOGY

CONTENT:



PCB etching is as simple as immersing it in the etchant solution and agitating it to keep sludge from inhibiting further etching. This can be done in plastic or glass trays, vertical etching tanks, or spray etchers. The goal of all of these methods is to dissolve all of the exposed copper and leave all of the unexposed copper. The acid FERRIC III CLORIDA is use in this process in order to ensure that all the connection can allow the current flow through the copper connection. The difference is throughput. A hobbiest is most likely to use a tray or a vertical tank.

Soldering is a process in which two or more metal items are joined together by melting and flowing a solder into the joint, the filler metal having a lower melting point than the workpiece. Soldering differs from welding in that soldering does not involve melting the work pieces.. Formerly nearly all solders contained lead, but environmental concerns have increasingly dictated use of lead-free alloys for electronics and plumbing purposes. Soldering is the only permanent way to ‘fix’ components to a circuit. However, soldering requires a lot of practice as it is easy to ‘destroy’ many hours preparation and design work by poor soldering. If we follow the right guideline, we can have a good connection on the PCB board.



OBJECTIVES:

  • To move to the next step before reach to the final part of the completing this project.
  • To learn how the correct way in order to etching and solder all the component in the PCB board.
  • To allow the current flow through the connection and make the component function well.
CONCLUSION:

I already done finish the important part that can allow me to see the whole of operation in this project. I can learn a lot of things in order to make it connect correctly.

Tuesday, 18 September 2012

PCB LAYOUT FOR METAL SENSOR

METHODOLOGY

CONTENT:



A schematic without convert to the PCB layout does not give a good end up in one project because that connection only can be complete and function well we apply on the PCB board. If the connection on PCB layout is done, then we can proceed to the mechanical part. That is the reason I convert the schematic to this PCB layout.

OBJECTIVES:
  • To convert a PCB layout from schematic circuit that already design before.
  • To move to the next step in order to make the project become complete.
CONCLUSION:

I have successfully complete up this part, so that I can move to the next step which is etching process..


Friday, 14 September 2012

CIRCUIT FOR METAL SENSOR

METHODOLOGY

CONTENT:





As one of the objective in this project to stop the vehicle at the specific place, so I design this circuit in order to achieve the objective. This circuit will give a signal to PIC circuit when the sensor detect a metal that put on the floor. When the PIC get the signal, then the PIC will pass the signal to the motor to stop the operation immediately. The reason why I design this circuit is because I want to make sure that this vehicle will stop at certain place such as at the factory, there have some place that need to stop the vehicle to ensure that the workers enable to put a load on this project. So, this operation can make the workers can finish up their task smoothly and efficiently.

OBJECTIVE:
  • To fulfill the objective of this project that can help the workers at factory do a task efficiently.
  • To complete up the whole operation of this project.
CONCLUSION:

By design this schematic circuit, it can ease for me to make the function of this project become successful.

Thursday, 6 September 2012

TEST THE OBSTACLE CIRCUIT

RESULT

CONTENT:


In order to ensure about the connection, I have try test the circuit on a breadboard first. To make the IR LED work well, I have increased the current to the LED to almost 50mA which is the maximum continuous current allowed. Because the LED is pulse on and off, this is quite safe and could have been increased to 100mA. To know how wide the detection area is, I used my hand as the object at the distance of approximately 300mm (12inches) from the single sensor, the detection area is about 150mm (6inches) wide. The double sensor can detect a wider area if the phototransistor are spread out at different angle. Using my hand side on the single sensor, the detection area was only about 60-70mm (2-3 inches). This is reasonably narrow due to the lenses in the LEDs and phototransistor. It should be noted that this is not a linear sensor because the intensity of light from the LEDs is 1 divided by distance squared. In other words, when the object is twice the distance away, the IR from the LED is 1/4. As a result,the closer the object, the better the resolution.

OBJECTIVES:
  • To test about the connection is correct or not..
  • To see whether it can function well or not..